About Us
Chiral Photonics (CPI), founded in 1999, designs, develops and produces fiber-based components and assemblies. CPI’s products and related services, include:
Multicore fiber fanouts
High density fiber arrays
Pump-signal combiners
High temperature sensors
In-fiber polarizers
Optical probing of photonic integrated circuits (PICs)
PIC packaging
Fiber optic switches
CPI continues to innovate, through its research and development programs, often together with industry and government partners, in a broad array of technological areas, including:
Glass microforming
Fiber lasers and high power laser components
Space division multiplexing
Optical transceivers
Optical switching
Photonic lanterns
Optical probes for endoscopy and other medical and scientific applications
Shape sensing
Harsh environment fiber optic sensing
News and Events
World Photonics Technology Summit 2019
29-30 August 2019
Berlin, Germany
Invited Presentation: "Pitch Reducing Optical Fiber Array – Bridging the Gap Between Fiber Infrastructure and Dense Multichannel Optical Interfaces"
Photonics West 2019
Booth: 159
2 Feb 2019 – 7 Feb 2019
San Francisco, California, USA
OFC 2019
Booth: 4806
5-7 March 2019
San Diego, California, USA
Sponsors of the Pic Training Silicon Valley 2019, 28 January - 1 February, 2019
Presentations on photonic integration cover all the material systems, whether Silicon, InP-based, or dielectrics such as TriPleX (SiO2/Si3N4). The training is supported by a broad consortium of companies and is hands-on as well as in-depth.
Sponsors of the PIC Workshop at OFC 2018, Wednesday, Mar 14, 2018, Room 29ABCD
Wednesday, March 14, 2017 from 5:45 to 8:30pm. Presentations on photonic integration including overview of (MPW) foundries, design & layout S/W, packaging, test & measurement, design houses, etc., with special focus on what is new in these areas.
PIC Training Silicon Valley 2017
13 Nov 2017 - 17 Sep 2017, Santa Clara, California, USA
Chiral Photonics is a sponsor and presenter at the PIC Training Silicon Valley 2017 in Santa Clara, CA.
Chiral Photonics presented “Photonic Integrated Circuit Packaging Fundamentals” at the meeting where there were presentations and hands-on training led by industry experts across a broad spectrum of innovating companies.
Photonics Summit and Workshop 2017
06 Sep 2017 - 07 Sep 2017, San Jose, CA, USA
Chiral Photonics presented “Optical Input / Output Considerations for Photonic Integrated Circuit Coupling & Packaging” on September 6, 2017. Hosted by Cadence, Lumerical, and PhoeniX Software the Photonics Summit brings together developers, technology users, and industry experts for a full day of networking and education on the latest photonic tools and methodologies.
White House Announces New Integrated Photonics Manufacturing Innovation Hub with Chiral Photonics as key partner.
Pine Brook, NJ, July 27, 2015.
OptoDesigner 5 Adds Design Support for High Density Optical I/O and PIC Packaging, Chiral Photonics, Inc. Press Release, Pine Brook, NJ November 17, 2014.
Chiral Photonics introduces PROFA for high density, fiber-to-chip applications. Victor Kopp, Director of R&D, introduces the new technology (Video). OFC/NFOEC 2012 Conference, Los Angeles, CA, March 10, 2012.
"Chiral Photonics, Inc. demonstrates Pitch Reducing Optical Fiber Array (PROFA) enabling highly dense 2D fiber array interfaces", Chiral Photonics, Inc. Press Release, Pine Brook, NJ February 7, 2012.
Management
Dan Neugroschl
Co-Founder, President, and Chief Executive Officer
Immediately prior to co-founding Chiral Photonics, Dan served as VP of Operations and Advanced Development and a founder and director of Schick Technologies (since merged with Dentsply Sirona, Inc), a leading developer of digital radiography equipment. He began his career working in advanced packaging at IBM Research. Dan received an M.S. in Materials Science from Columbia University.
Azriel Genack
Co-Founder and Chief Technology Officer
Azriel brings over 30 years of research and industry experience. Presently, he is Distinguished Professor of Physics at City University of New York (CUNY) focusing on optical and microwave propagation, photon localization and lasing in random and periodic media, solid state and molecular physics, acousto-optic imaging, Raman scattering, coherent optical transient spectroscopy, magnetic resonance and photochemistry. He has published over 100 academic papers. Previously he was Senior Staff Physicist at Corporate Research Laboratories, Exxon Research and Engineering Company and a Researcher at IBM’s Almaden Research Center. Azriel holds a B.S. and Ph.D. in Physics from Columbia University.
Victor Kopp
Co-Founder and Director, Research and Development
Before co-founding Chiral Photonics, Victor was a Post-Doctoral Researcher at CUNY. His research interests, which were presented in numerous publications, included wave propagation through periodic media, nonlinear optics and photonic devices. Together with Azriel Genack, he developed the basis for Chiral Photonics’ technology in CLC lasing. Prior to this, as a Senior Researcher at the Vavilov Optical Institute in St. Petersburg, he investigated the interaction of electron and Raman resonances and lasing in Raman-active crystals, and photo-induced second harmonic generation in glasses, work which led to authoring and co-authoring 11 patents. Victor earned an M.S. in physics from St. Petersburg University and a Ph.D. degree in laser physics from the Vavilov Optical Institute, Russia.
Jonathan Singer
Director, Engineering
Jonathan Singer comes to Chiral Photonics from Schick Technologies, of which he was the VP of Engineering, co-founder, and director. At Schick he supervised over forty mechanical, electrical and software engineers, leading the development cycle of products. Prior to Schick, he served as a project engineer at Cox and Company. In his areas of expertise, x-ray analysis and chaotic systems, he holds a number of patents and has authored several publications . Jonathan received his B.S. from the Massachusetts Institute of Technology and M.S. from the University of Pennsylvania, both in Mechanical Engineering.